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SEMICONDUCTOR COMPONENTS
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IC Package (Ceramics)
Pin grid array (PGA)- Package for crystal device and SAW filter, SMD type
- Package for crystal device and SAW filter, CSP type
- Package for camera modules
- Package for MEMS and various sensors
- Side blaze package
- Quad flat package
- Package for flip chips
- Package for high frequency
- Package for opto-devices
- Custom package
- Thin film wiring substrate
- Substrate for probe card
- LTCC/multilayer substrate
- LTCC/RF module
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