Surface Mounted Package for Electronic Devices
About Surface Mounted Packages for Electronic Devices
NTK's strictly controlled green sheets are laminated with high precision to contribute miniaturization of electronic devices such as MEMS device, Quartz crystal, Crystal oscillator and so on.
Surface Mount Ceramic Packages
These ceramic packages for surface installations allow an airtight seal while offering reduced size and weight with a lower profile. Ceramics provide higher rigidity than conventional materials, yet also offer the greater strength that is required.
Crystal oscillators, crystal transmitters, SAW filters
Both HTCC and LTCC materials are available. Please refer to the table of the material properties with respect to material properties.
Products can be ordered individually or in lots as needed. We also offer optimal designs and standard products responding to customer needs.
- IC Package's Roles
- High Temperature Co-Fired Ceramic (HTCC) Packages and Substrates
- Surface Mounted Packages for Electronic Devices
- Packages for Image Sensor
- Ceramic Packages for Automotive Applications
- Packages for High-Frequency Devices and Opto-Devices
- LED Packages
- Large-Scale Substrates for Wafer Testers
- Low Temperature Co-Fired Ceramic (LTCC) Substrates