Packages for Image Sensor
About Packages for Image Sensors
From Mobile phone, digital camera, industrial equipment to medical equipment, our package is to support the image sensor technology.
Ceramic Packages for CMOS/CCD
We offer ceramic packages using multilayer ceramics with characteristics including high rigidity, lower profile and greater compactness, low warpage, and excellent dustproof performance.
We also offer designs and standard products based on the customer's requirements.
Suitable for industrial and CMOS/CCD packages.
- IC Package's Roles
- High Temperature Co-Fired Ceramic (HTCC) Packages and Substrates
- Surface Mounted Packages for Electronic Devices
- Packages for Image Sensor
- Ceramic Packages for Automotive Applications
- Packages for High-Frequency Devices and Opto-Devices
- LED Packages
- Large-Scale Substrates for Wafer Testers
- Low Temperature Co-Fired Ceramic (LTCC) Substrates