Technological innovation in the electronics industry caused attention to converge on the technology for applying ceramics to a variety of fields.
NGK SPARK PLUG, too, had been promoting the development of a technology for utilizing ceramic products since the late 1960's. This led to the birth of various electronic parts and the development of piezoelectric ceramic applied products.
Lots of semiconductor production related parts also were made to keep pace with developments in electronic equipment.
And, the laminating technology that we have acquired in many years of IC package fabrication also is being put to use in our sensor products.

Ceramic IC Package

Ceramic packages are "containers" for mounting and protecting IC chips made of silicon and other components.
NGK SPARK PLUG began basic research into these in 1965. After developing the technologies of glass sealing, metallization and plating, we exhibited prototypes at exhibitions worldwide and started production in 1967.
In 1968, we received approval for our ceramic packages from the then Nippon Telegraph and Telephone Public Corporation (currently, NTT) and these were adopted in electronic exchanges and computers. In parallel with this technology, we succeeded in the development of a "co-firing technology" for simultaneously performing sintering after forming a laminate by pressure and humidification. Production of these ceramic packages was begun in 1968. These products were shipped to America to become our first electronic component export.
From then on, our ceramic packages continued to evolve. In addition to their application in substrates for submarine cable relays and Grace substrates for thermal printers, our core technology is currently being applied in a variety of products. For example, ceramic package technology is in use in hydrogen leak detection sensors.

Electro-static Chuck

With ceramics that have electrostatic functions, discharge electrodes and conduction electrodes are formed by tungsten metallization technology on the surface and inside of an alumina substrate which has high electric insulation properties.
If a high frequency and high voltage are impressed between both of these electrodes, an electric field can be generated in the periphery to bring about an electrostatic phenomenon on a substance.
In 1990, we developed a 6" electro-static chuck for use with silicon jointly with ULVAC, Inc., and promoted sales of this chuck as a high added value product.
Electro-static chucks have spread extensively in semiconductor production as devices for holding silicon wafers in place by suction. NGK SPARK PLUG's electro-static chucks have high plasma resistance and resistance to process gases. We applied our sheet fabrication, metallization and precision fabrication technologies to these chucks, and incorporated a newly developed metal adhesion technology. As a result, we succeeded in establishing a technology for producing electro-static chucks with a 12" size alumina base. This is being developed as a new high added value product and currently up to 18" size bases are supported.

Organic Buildup Substrate

In the 1990's, increased use of personal computers led to an intensification of the price war.
We were confronted with the need to switch over from ceramic IC packages, which were also a mainstay of our business, to IC packages made of organic plastic to keep costs down. In 1998, in response to changes in the market place, NGK SPARK PLUG began production in the new field of "organic substrates."
Initially, we adopted other companies' methodologies in production, but then switched over to our own manufacturing system, NTS. At the same time, we promoted the shift over to larger size substrates and increased efforts to improve production efficiency.
Driven by a worldwide IT boom and active personal computer markets mainly in Brazil, Russia, India and China (BRICs), earnings from these substrates were brisk. However, we stopped production of these substrates in March, 2016. From here on, we will put the expertise gained in organic packages to effective use in other business.

High-strength HTCC Package for Crystal Device

The increasingly advanced functions of ceramic packages led to expanded applications in not only personal computers but also in various devices typified by cellphones and tablet terminals.
Of these, even higher performance was required in crystal chips used as frequency filtering SAW filters and reference frequency oscillators since they are, in particular, apt to be damaged by moisture. Also, due to the particularly strong demand for smaller packages for miniaturizing units, the trend is to further downsize various components geared towards the arrival of the full-scale IoT age. On the other hand, though, they have to be strong enough to withstand drop impact and satisfy conflicting requirements.
NGK SPARK PLUG's high-strength HTCC packages for crystal devices are designed in a highly airtight sealed structure, are compact and lighter in weight, and have a lower profile. Consequently, demand for these packages is expected to increase even more in the future.


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